| 摘要 |
PROBLEM TO BE SOLVED: To provide a producing method for a multilayered substrate with which an internal wiring pattern can be surely formed at a desired position and the cross section of the internal wiring pattern can be formed into a sharp rectangle. SOLUTION: An internal wiring pattern forming process is provided with a process (a) for sticking a photosetting resin film 7 on an insulating layer mold 11f, a process (b) for forming a through hole 35 in the part corresponding to an internal wiring pattern 41 by exposing and developing the photosetting resin film 7, a process (c) for filling the through hole 35 on the photosetting resin film 7 with conductive paste, and a process (d) for releasing the photosetting resin film 7 from the insulating layer mold 11f. |
