| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film electronic component wherein crack generation in an insulator layer is prevented and insulation performance can be assured. SOLUTION: This electronic component comprises a supporting substrate 1, a thin film element provided on said supporting substrate 1 and having the insulator layer 3 and electrode layers 5, 7, a protective layer 9 to envelop a non-formation area of insulator layer B wherein said thin film element A and the insulator layer 3 are not formed, and solder bumps 11 that are provided on said protective layer 9. In addition, the protective layer 9 in the non- formation area of insulator layer B is provided with through-holes 13a, 13b and a lower solder of solder bumps 11 is filled in the through-holes 13a, 13b and metal layers for bottom face solder scattering protection 17 are formed between the solder bumps 11 and the electrode layers 5, 7 exposed at bottom faces of through-holes 13a, 13b.
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