| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a mounting method thereof capable of repairing a wiring substrate and improving repairability. SOLUTION: The semiconductor device has a thermally plastic resin layer 4a between a thermosetting resin layer 3a and a wiring substrate 7 sealing a semiconductor element 1 and the wiring substrate 7. A thermoplastic resin film 4 is bonded on the wiring substrate 7, and a thermosetting resin 3 is supplied on the thermoplastic resin film 4. An edged protruding electrode 2 formed on the semiconductor element 1 breaks through the thermoplastic resin film 4 to come in contact with an interconnecting pattern of the wiring substrate 7 for connection. The thermosetting resin 3 and the thermoplastic resin film 4 are heated to fuse and solidify the thermoplastic film 4. At the same time, the thermosetting resin 3 is cured to connect the semiconductor element 1 to the wiring substrate 7. |
