| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which is hard to produce a joint failure during wire bonding for inner lead regardless of multiple pin accompanied with high integration. SOLUTION: A projection 3b is projectingly formed on the opposite side to a side pressed by a wind clamper 9 in the tip end 3a of an inner lead 3, and the tip end 3a is made larger in thickness than the other parts, and then a semiconductor chip mounted to a die pad 2 and the inner lead 3 are connected with each other by a bonding wire 4. In this case, the tip end 3a is pressed and fixed uniformly and stably to a platen 10 by using the wind clamper 9.</p> |
