| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board with which crack on a connecting conductor charged in a through hole can be effectively prevented and resistance of this connecting conductor can be suppressed low. SOLUTION: Concerning a multilayer wiring board, a firs wiring layer 2 and the second wiring layer 3 are successively laminated on the upper surface of a substrate 1 while interposing an insulation layer 4 and the first wiring layer 2, and the second wiring layer 3 are electrically connected by a connecting conductor 6 inside a through hole 5 provided on the insulation layer 4. The connecting conductor 6 contains oxidized tungsten particles 7 just in 0.1 to 7.0 wt.%. |
