SEMICONDUCTOR MODULE FOR ELECTRIC POWER

摘要

PROBLEM TO BE SOLVED: To solve problems of downsizing of a metal base and a heat resistance insulation plate as well as reduction of steps for external terminals in the conventional semiconductor module for electric power in which a semiconductor chip and a part of external terminals are mounted to the metal base by means of the heat resistance insulation plate. SOLUTION: An external terminal 4 is bent at a bonding wire 6 connected in advance to the external terminal 4 and it is fitted in parallel to the side surface of an insulative case frame 5, and then the external terminal 4 is arranged orthogonally against a metal base.