ANISOTROPY CONDUCTIVE MATERIAL

摘要

PROBLEM TO BE SOLVED: To solve the problems that can easily be caused a crack between substrates by heat cycle in mounting an IC chip by an anisotropy conductive material and a sufficiently stable conductivity cannot be obtained by contacting only thought a hardening shrinkage of resin in the case of directly contacting an LSI chip into which a metal bump is formed on a substrate using an optical hardening resin. SOLUTION: A metal concentration of metal particles among anisotropy conductive material obtaining an electrical contact between electrodes continuously changes from a surface layer of the particles toward a central part and a melting point changes with inclination according to proceeding from the surface layer toward the central part.