| 摘要 |
PROBLEM TO BE SOLVED: To prevent adhesion of unnecessary solder to a pin in a substrate having a solder resist layer formed by opening a pin joint to which a lead pin having a flange is soldered. SOLUTION: The substrate has such a structure as the flange 123 of a pin 121 is abutted, on the periphery thereof, against the circumferential fringe of an opening 116 made in a solder resist layer 115 surrounding a pin joint 111 and soldered thereto. Since the flange 123 serves as a cover for blocking the flow of molten solder at the time of soldering the pin 121, the solder is prevented from spreading over the flange 123 at the time of soldering. |
