SEMICONDUCTOR MOUNTING DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To materialize a flip chip mounting at a low cost without forming a bump onto an IC chip. SOLUTION: An adhesive agent is applied on the side of a wiring pattern in a wiring-patterned sheet substrate. The IC chip is mounted on the opposite side, and the adhesive agent interposing between an electrode pad and the wiring pattern of the IC chip is removed by applying ultrasonic wave from the back of the wiring pattern. During the above process, the electrode pad and the wiring pattern are removed by the ultrasonic wave to assure connecting reliability without bump.