发明名称 Electronic power circuit with flat heat sink device
摘要 The electronic circuit has a flat heat sink device (4) for dissipating the waste heat generated by the power components of the electronic circuit , e.g. insulated gate bipolar transistors. The heat sink device has deformable regions for providing heat reception areas (8), heat transport areas (10) and heat dissipation areas (11). The heat sink device may incorporate cooling fluid channels and/or hollow spaces (9) containing a gas which is vaporised by the received heat and condensed upon heat dissipation.
申请公布号 DE19960840(A1) 申请公布日期 2001.07.05
申请号 DE1999160840 申请日期 1999.12.16
申请人 SIEMENS AG 发明人 FRANKE, TORSTEN;DILLIG, REINHOLD;RAITH, SEBASTIAN
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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