and connecting a contact element onto a substrate

摘要

A contact element (17) is located on a substrate surface (20) and held in position by bonding head (11) and solder bumps (22,23) on the substrate. A laser source (19) is directed onto the element (17) to melt the bumps and allow movement of the element over the substrate surface. An ancillary laser source (21) also mounted on the substrate is directed towards the element end so that the laser beam can pass through the element and measured by device (25). The relative position of the element w. r. t. the source (21) can be changed until a max. value of energy is recorded by device (25). At this point the main laser source is switched off and the solder solidifies.