发明名称 ELECTROLYTIC COPPER FOIL
摘要 <p>An electrolytic copper foil, characterized in that 20 % or more of crystals in the lustrous face side thereof have twin structure; a method for manufacturing the electrolytic copper foil by an electrolysis process comprising preparing a separated foil, characterized in that a titanium material having a grain size number of 6.0 is used for a rotary cathode drum and a copper sulfate solution containing 0.2 mg to 20 mg/l of glue and/or gelatin is used as an electrolyte. The use of the electrolytic copper foil can provide a copper foil which exhibits excellent adhesion to an etching resist layer without being subjected to a physical polishing such as buff polishing in the face processing treatment in an etching process for a copper foil circuit.</p>
申请公布号 WO0148272(A1) 申请公布日期 2001.07.05
申请号 WO2000JP08330 申请日期 2000.11.27
申请人 MITSUI MINING & SMELTING CO., LTD.;NAKANO, OSAMU;KATAOKA, TAKASHI;TAENAKA, SAKIKO;UCHIDA, NAOHITO;HANZAWA, NORIKO 发明人 NAKANO, OSAMU;KATAOKA, TAKASHI;TAENAKA, SAKIKO;UCHIDA, NAOHITO;HANZAWA, NORIKO
分类号 C25D1/04;C25D3/38;H05K1/09;(IPC1-7):C25D1/04 主分类号 C25D1/04
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