IC-COMPATIBLE PARYLENE MEMS TECHNOLOGY AND ITS APPLICATION IN INTEGRATED SENSORS
摘要
A combined IC/Mems process forms the IC parts first, and then forms the MEMS parts (110). One option forms a parylene overlayer, then forms a cavity under the parylene overlayer.
申请公布号
WO0054312(A8)
申请公布日期
2001.07.05
申请号
WO2000US06230
申请日期
2000.03.10
申请人
CALIFORNIA INSTITUTE OF TECHNOLOGY;JIANG, FUKANG;HAN, ZHIGANG;WANG, XUAN-QI;TAI, YU-CHONG
