SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to reduce the manufacturing cost and simplify the manufacturing process using an existing printed circuit board as a semiconductor package on which a semiconductor chip for CCD is mounted. CONSTITUTION: A semiconductor package(100) includes a semiconductor chip(2) on a portion of which a plurality of input/output pads(2a) are formed. A printed circuit board is adhered by an adhesive at the bottom of the semiconductor chip. A circuit pattern including a plurality of bonding fingers(11) are formed on the top of the printed circuit board and a circuit pattern including a plurality of lands(12) are also formed at the bottom of the printed circuit board, centering around a resin layer(10). The circuit patterns are connected by a conductive via hole(13). A conductive wire(20) electrically connects the input/output pads of the semiconductor chip and the bonding fingers of the printed circuit board. A dam(30) is formed approximately higher than the height of a loop of the conductive wire on the top of the printed circuit board. Glass(40) is adhered on the dam so that outside light can be incident to the semiconductor chip. Input/output terminals are formed on the lands at the bottom of the printed circuit board.