| 摘要 |
PURPOSE: A wire bond head for manufacturing a semiconductor package is provided to increase wire bonding yield by rejecting resistance heat due to coils and electromagnetic field decrease phenomenon due to the heat. CONSTITUTION: The device includes a support(2), a transducer(4), a capillary(6), a distance sensor(12) and a Z motor(16). The support is made of external frames. The transducer is coupled with one terminal of the support in a bar formation. The capillary is implemented on one end of the transducer and bonds a conductive wire. The distance sensor is implemented on one side of the support to detect the height of the capillary. The Z motor drives the capillary in Z direction. A cooler is further included on one terminal of the support. The cooler emits air to as to prevent temperatures of the distance sensor and the Z motor from rising. The cooler is coupled with the side of the support by forming a common hole and tiny holes are formed on the side which faces the Z motor. |
