| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing metallic particles for an anisotropic conductive film having high hardness, small in the defect of contact and having a uniform shape instead of the conventional conductive particles in which resin particles are applied by Au plating. SOLUTION: In this method for producing metallic particles for an anisotropic conductive film, a plating layer essentially consisting of a metal of Ni, Cu or Ag is formed on a substrate, the surface of the plating layer is deposited with a resinous resist film, the resist film is provided with a groove part so as to pierce to the plating layer, thereafter, the plating layer is subjected to etching working from the groove part, the resinous resist film is melted away, and the plating essentially consisting of either metal of Ni, Cu or Ag is peeled from the substrate to obtain columnar metallic particles for an anisotropic conductive film.
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