发明名称 |
ELECTROLYTIC COPPER FOIL |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide copper foil highly adhesive to an etching resist layer by the surface finishing in the etching process of a copper-foil circuit without applying physical polishing such as buffing. SOLUTION: A titanium material of >=6.0 crystal grain size number is used in a rotary cathode drum in the electrolysis for manufacturing electrolytic copper foil. The electrolytic copper foil uses deposited torn-off and wound foil obtained by adding 0.2-20 mg/L glue and/or gelatin to a copper sulfate solution to be used as an electrolyte and with the crystal on the glossy-surface side of the foil having >=20% twin crystal structure.</p> |
申请公布号 |
JP2001181886(A) |
申请公布日期 |
2001.07.03 |
申请号 |
JP19990372563 |
申请日期 |
1999.12.28 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
NAKANO OSAMU;KATAOKA TAKU;MYONAKA SAKIKO;UCHIDA NAOHITO;HANZAWA NORIKO |
分类号 |
C25D1/04;C25D3/38;H05K1/09;(IPC1-7):C25D1/04 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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