发明名称 |
Selective wafer-level testing and burn-in |
摘要 |
Selective electrical connections between an electronic component and a test substrate are made using an electrical conductive material. The conductive material of the present invention is a dissolvable material, allowing for rework and repair of a wafer at the wafer-level, and retesting at the wafer-level. In addition, the conductive material may also be used in a permanent package, since the conductive material of the present invention provides complete electrical conductivity and connection between the electronic component and the substrate.
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申请公布号 |
US6255208(B1) |
申请公布日期 |
2001.07.03 |
申请号 |
US19990236927 |
申请日期 |
1999.01.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERNIER WILLIAM EMMETT;BERTIN CLAUDE LOUIS;BHATT ANILKUMAR CHINUPRASAD;GAYNES MICHAEL ANTHONY;HEDBERG ERIK LEIGH;MURDESHWAR NIKHIL M.;PIERSON MARK VINCENT;TONTI WILLIAM R.;TOTTA PAUL A.;VAN HORN JOSEPH JOHN;ZALESINSKI JERZY MARIA |
分类号 |
H01L21/60;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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