| 摘要 |
PROBLEM TO BE SOLVED: To provide a nonhalogen- and nonantimony-type heat-curable resin which excels in heat resistance and is useful for wiring boards, a prepreg and a metal clad laminated sheet using the resin. SOLUTION: A heat-curable resin composition comprises (A) an epoxy resin, (B) a heat-curable resin whose major component is a compound having a dihydrobenzoxazine ring, and (C) a polycondensate of a phenol, a compound having a triazine ring and an aldehyde and, in addition, (D) 1-50 pts.wt. reactive type phosphorus compound based on 100 pts.wt. total amount of components (A), (B), and (C). The pregreg is obtained by impregnating a substrate with this heat-curable resin composition and drying the resulting impregnated material, and the metal clad laminated sheet is obtained by laminating a metal foil on one side or both sides of this pregreg or a laminate obtained by laying one prepreg on another and subjecting the resulting laminate to heat press molding.
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