| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin paste composition having lower stress and lower moisture absorption and excellent in adhesion strength to a copper lead frame and an organic substrate when used as a die bonding material of a semiconductor device and a semiconductor device excellent in reliability small in chip cracks or chip warps and reduced in packaging cracks upon soldering reflow by using the resin paste composition as an adhesive. SOLUTION: The resin paste composition comprises (A) a butadiene oligomer, (B) an acrylate or methacrylate, (C) a radical initiator and (D) a filler uniformly distributed in the composition. The semiconductor device is produced by adhering a semiconductor element to a supporting member using the resin paste composition and then sealing the element.</p> |
