| 摘要 |
PROBLEM TO BE SOLVED: To upgrade the adhesion between a resin and a conveying tape and obtain the cured resin free from 'scorch', 'bulge' or 'formation'. SOLUTION: This method for curing a resin has a tape supply/delivery process for supplying a conveying tape 3 on which the resin 5 for sealing an element 4 is applied from a tape inlet 15 of a furnace 2 and delivering the conveying tape 3 from a tape outlet 16 of the furnace 2 and a heating/curing process for heating and curing the resin 5 in the furnace 2 while reversing the feed direction of the conveying tape 3 by reversing means 6, 7 during the tape supply/ delivery process. In addition, the heating/curing process includes an indirect heating process for indirectly heating the conveying tape 3 under such a setup that hot plates 11, 12, 13 heated by heating elements 8, 9, 10 are arranged between one of the faces of the conveying tape 3 and the heating elements 8, 9, 10 as a heat source and under such a state that the width of the hot plates 11, 12, 13 is largest among the widths of the conveying tape 3, the heating elements 8, 9, 10 and the hot plates 11, 12, 13. A resin curing device is a realization of the method for curing the resin as a hardware device.
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