| 摘要 |
PURPOSE: A cleaning unit is provided to execute washing and removing surface impurities continually using only one cleaning unit. CONSTITUTION: Cleaning equipment applies to a semiconductor wafer(110) for washing after a CMP(Chemical Mechanical Polishing) process. The semiconductor wafer(110) is loaded on a holding unit, chuck(140). A cleaning unit(150) washes the wafer(110). The cleaning unit(150) is composed of a brush(120), a washing solution injecting nozzle(130), an arm(160), a body, and a power transferring part. The power transferring part consists of a brush rotary motor, a body rotary motor, and an up-down motor. The brush(120) is moved with the body upon the wafer(110) following the movement of the body rotary motor and the up-down motor. The brush(120) rotates with contacting on the wafer(110) to clean the wafer(110). After removing impurities from the wafer(120), Deionized water is spread from the washing solution injecting nozzle(130).
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