| 摘要 |
PURPOSE: A BGA(Ball Grid Array) type stack chip package is provided to realize a stack chip even if the size difference of semiconductor chips is large, and to reduce a thickness of the stack chip package. CONSTITUTION: An aperture(48) is formed on a center part of a PCB(Printed Circuit Board)(42) to stack semiconductor chips(32,34). The first semiconductor chip(32) having a bottom surface larger than the aperture is formed on an upper surface of the PCB. The second semiconductor chip(34) is attached to the bottom surface of the first semiconductor chip revealed by the aperture of the bottom surface of the PCB. The second semiconductor chip has a smaller size than the aperture. The upper surfaces of the first semiconductor chip and the PCB are connected electrically by the first bonding wire(33), and the bottom surfaces of the second semiconductor chip and the PCB are connected electrically by the second wire bonding(35). And, package bodies(44,45) are formed by sealing a part where the semiconductor chips are mounted with a liquid phase plastic resin to protect the part from the external environment. And, a plurality of solder balls(46) are arranged on the bottom surface of the PCB of the outside of the second package body. |
