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发明名称
Flip chip mounting method using a solderfill
摘要
申请公布号
KR100484888(B1)
申请公布日期
2005.04.28
申请号
KR20020068776
申请日期
2002.11.07
申请人
发明人
分类号
H01L23/12;(IPC1-7):H01L23/12
主分类号
H01L23/12
代理机构
代理人
主权项
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