| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module substrate, which can solve the problem of voids occurring in solder or the wettability of solder deterioration at soldering, for mounting a semiconductor element due to a metal layer which is formed on the surface of the porous metal layer of a circuit board for power module by electroless plating nickel, etc., to make the solder or a brazing material flow smoothly. SOLUTION: This power module substrate is constituted, in such a way that the porous metal layer formed at least on one surface of a ceramic substrate is covered with a metal layer, having a remaining tensile stress of 300-700 MPa, and the semiconductor element, etc., are mounted on the metal layer.
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