| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink device of which pressure applied to an integrated circuit. can be easily controlled even if the integrated circuits are varied in height and which is equipped with a heat sink fixing means that is less temperature-dependent. SOLUTION: A heat sink device is equipped with a fixing part 10 which fixes the heat sinks 3 to its fixing frame 5 separately pressing integrated circuits 2 of different heights with the one ends of heat sinks 3.
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