| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a rear-surface grinding method of semiconductor devices, where the bending amounts generated in individual chips are so unified and minimized when the rear surfaces of the semiconductor devices in chip states are ground as to make their bending directions and bending tendencies capable of being unified. SOLUTION: In this method, the grinding surface of a grinder is so contacted with the rear surfaces of plural semiconductor chips 60, arranged on a table 61a opposed to the grinding surface of the grinder that the rear surfaces of the semiconductor chips 60 are ground by moving them relatively to the grinding surface of the grinder. In this case, the respective semiconductor chips 60 are arranged on the table 61a, so that there are made nearly equal to each other the forming directions of saw marks S-MK, which are generated by grinding in the rear surfaces of the plurality of semiconductor chips 60.</p> |
