| 摘要 |
PROBLEM TO BE SOLVED: To provide a cross board which can package a semiconductor component in a high density, and the packaging method of the component. SOLUTION: Component side electrodes 16 on a circuit formation surface 12a of a semiconductor component 12 are connected with conductive filaments 20a to 20f in a cross base material 30 in the ratio of 1 to 1 through solder bumps 15 and thereafter, the component 12 is resin-sealed with a fused epoxy resin. Hereby, the component 12 is formed into a constitution that the side of the surface 12a of the component 12 is sealed with a sealing resin 11 in the base material 30 in a state that the electrodes 16 on the packaged component 12 are electrically connected with the conductive filaments 20a to 20f which are wirings in the cross base material 30. |
