发明名称 ANISOTROPIC CONDUCTIVE SHEET FOR PACKAGE EVALUATION AND METHOD OF PACKAGE EVALUATION USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive sheet for package evaluation capable of preventing a defective contact in an electrical connection between a package and a substrate for evaluation, and a method of package evaluation using the conductive sheet. SOLUTION: This anisotropic conductive sheet for package evaluation is provided between a package and a substrate for evaluation and allows the electrodes provided on the surfaces of the package and substrate opposed to each other to be connected electrically to each other when the characteristics of the package having a plurality of electrodes disposed on one surface of a main body as external terminals are evaluated. A bump having a conductivity and an elasticity is formed of at least any one of the surfaces opposed to the package of the anisotropic conductive sheet and substrate for evaluation at a portion corresponding to the electrode position on the package and substrate side.
申请公布号 JP2001174507(A) 申请公布日期 2001.06.29
申请号 JP19990358930 申请日期 1999.12.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 KANETANI YASUSHI
分类号 H01R11/01;G01R1/073;G01R31/26;(IPC1-7):G01R31/26 主分类号 H01R11/01
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