发明名称 SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a component soldering device that eliminates the need for preparing flux liquid, is formed into one piece, can simultaneously solder a plurality of parts, and at the same time can be easily incorporated into a production line to make corresponding to a small amount of many kinds production. SOLUTION: This soldering device is equipped with a solder tank 2, a fluxing device 3 having a nozzle and a pump for jetting flux undiluted solution to an object to be soldered (a substrate 6), and a traveling lift device 4 for moving the object. On the upper surface of the solder tank 2, a dip cover 32, where solder nozzles 33a to 33f corresponding to a plurality of soldering positions of the object project is provided, and the solder tank 2, the fluxing device 3, the traveling lift device 4, a container for flux undiluted solution, and a waste liquid container are mounted to a movable trestle 1 for forming it into one piece.
申请公布号 JP2001177229(A) 申请公布日期 2001.06.29
申请号 JP19990354619 申请日期 1999.12.14
申请人 SONY CORP 发明人 ANDO TAKANORI
分类号 B23K1/00;B23K1/08;B23K3/00;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
代理机构 代理人
主权项
地址