SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To suppress the shaking of a center pad chip and to stably fix the center pad chip when the center pad chip is mounted on a wiring board by facing down. SOLUTION: A semiconductor device has a semiconductor chip having outer electrodes arranged near a center line on a semiconductor substrate in a straight line, the wiring board which is confronted with the main face of the semiconductor chip and in which a metal wiring corresponding to the outer electrode is installed, and projection electrode connecting the outer electrodes of the semiconductor chip and the metal wiring. The projections fixing the semiconductor chip and the wiring board are installed in an outer peripheral area on the main face of the semiconductor chip.