| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of deterioration of electrical characteristics caused by reflection of high frequency signal and radiation loss in a connection part of a usual connection structure by means of flip-chip mounting. SOLUTION: In the connection structure of a high frequency component, a first high frequency component 21, wherein a ground conductor 23 is formed in an upper surface side of a substrate 22 and a line conductor 24 is formed in a lower surface side, is electrically connected to a second high frequency component 26, where a plurality of ground conductors 28a to 28c are formed in a lower surface side of a substrate 27 formed by laminating dielectric layers 27a to 27c and line conductors 29a, 29b are formed in an upper surface side, by means of a conductive connection member 31 by opposing connection parts 25a, 25b, 30a, 30b mutually. A plurality of holes 32 are provided in the structure to a portion of at least one layer of the dielectric layers 27c, 27b at an uppermost surface side of the dielectric layers 27a to 27c of a second high frequency component 26 opposing a line conductor 24 of the first high frequency component 21. According to the constitution, it is possible to improve electrical properties by restraining reflection of high frequency signal and radiation loss and to eliminate difficulties in manufacturing. |
