| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of bonding module substrate by which the number of soldering times can be reduced, and at the same time, the mounting area of a module substrate mounted with parts on both surfaces can be enlarged at bonding of the substrate to a printed board in a laminated state. SOLUTION: At bonding of a module substrate 5 mounted with components 3 and 4 on both upper and lower surfaces to a base printed board 1 in a laminated state, the substrate 5 can be bonded to the board 1 via a spacer 6 carrying solder balls 8 and 9 temporarily fixed to both upper and lower surfaces by one time of soldering, by in-batch reflow soldering in a state, when the spacer 6 is temporarily fixed between the substrate 1 and board 5.
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