| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for semiconductor device, in which a semiconductor device can be mounted without touching the surface or side of the device with tweezers, when mounting the semiconductor device whose surface and side are inhibited from being touched on a package. SOLUTION: A package for a semiconductor device electrically connects a semiconductor device stored with its bottom surface side opposed to a base to an external device. A semiconductor device 1 is places on the base 3 of a package 2, and a hole 6 a having prescribed size is made in the base 3, where the bottom surface of the semiconductor device 1 adheres to.
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