ENCAPSULANT COMPOSITIONS WITH THERMAL SHOCK RESISTANCE

摘要

A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0 DEG C and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to 40% by weight of an adhesion promoter, and an optional viscosity-modifying component.