ELECTROLESS PLATING SOLUTION AND METHOD OF FORMING WIRING WITH THE SAME

摘要

An electroless plating solution which less influences semiconductor properties while attaining a controlled plating rate and does not pose a problem concerning health control of workers; and a method of wiring formation which comprises an electroless plating step employing the electroless plating solution. This electroless copper plating solution is characterized by containing divalent copper ions, a complexing agent, an aldehyde-acid, and an organic alkali. It is suitable for filling the grooves in a semiconductor substrate surface with copper through a step in which a subsidiary seed layer for reinforcing a copper seed layer formed in the wiring grooves is formed and a step in which electroplating is conducted using as a feeder layer the seed layers including the subsidiary seed layer.