| 发明名称 |
Method and device for treating two-dimensional substrates, especially silicon slices (wafers), for producing microelectronic components |
| 摘要 |
The invention concerns a method and a device for treating and processing flat substrates such as silicon slices (wafers) for producing microelectronic components in vertical alignment.
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| 申请公布号 |
US6251551(B1) |
申请公布日期 |
2001.06.26 |
| 申请号 |
US20000462829 |
申请日期 |
2000.01.14 |
| 申请人 |
KUNZE-CONCEWITZ HORST |
发明人 |
KUNZE-CONCEWITZ HORST |
| 分类号 |
G03F7/20;H01L21/00;H01L21/027;H01L21/304;H01L21/677;(IPC1-7):G03F9/00 |
主分类号 |
G03F7/20 |
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