发明名称 CMP ABRASIVE SLURRY-CONTAINING WASTE WATER TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a CMP abrasive slurry-containing waste water treating device capable of flocculating fine abrasive grain or the like contained in the CMP abrasive slurry-containing waste water discharged from a CMP process and solid/liquid separating to easily recover water containing no solid matter. SOLUTION: The CMP abrasive slurry-containing waste water treating device has an oxidizing device for oxidizing the CMP abrasive slurry-containing waste water, a flocculation reaction device for performing the flocculation reaction by adding a flocculant to the oxidized waste water and a solid/liquid separation device for separating the solid matter in the waste water, to which the flocculation reaction is applied.
申请公布号 JP2001170652(A) 申请公布日期 2001.06.26
申请号 JP19990353387 申请日期 1999.12.13
申请人 KURITA WATER IND LTD 发明人 MORITA HIROSHI
分类号 C02F1/72;C02F1/52;(IPC1-7):C02F1/52 主分类号 C02F1/72
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