发明名称 BOARD SEPARATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of separating a board without deteriorating a method constitution on the board. SOLUTION: A supporting case 12 for supporting board 11, a circular push cutting blade 14 composed to be sharp at a circumferential end part, and supported to be rotatable around a rotation shaft parallel to the surface of the supporting base 12 at a specified hight from the supporting base 12, and movable in the axial direction of the rotation shaft, and an optical sensor 16 to detect a position of a groove 7a in the axial direction of the rotation shaft are provided, the circumferential end part of the push cutting blade 14 is applied to the groove 7a to be moved along the groove 7a for pressing the board 11 by the push cutting blade 14 and the supporting case 12, the position of the groove 7a is detected by the optical sensor 16, and a position of the push cutting blade 14 in the axial direction of the rotation shaft is controlled while the push cutting blade 14 is moved along the groove 7a for cutting the board 11.
申请公布号 JP2001170890(A) 申请公布日期 2001.06.26
申请号 JP19990360062 申请日期 1999.12.20
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 MURAYAMA KENJI;SAKUTA HIROSHI;ONISHI MASAMI
分类号 B26D5/34;B26D1/14;H05K3/00;(IPC1-7):B26D5/34 主分类号 B26D5/34
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