发明名称 Method for manufacturing semiconductor device
摘要 A method for producing a semiconductor device includes the steps of: forming an impurity diffusion layer for controlling a threshold voltage by ion implantation; and conducting a high-temperature rapid heat treatment for recovering crystal defects generated by the ion implantation. More specifically, treatment conditions for the high-temperature rapid heat treatment are set in such a manner that interstitial atoms causing the crystal defects are diffused, and impurities in the impurity diffusion layer are not diffused. For example, the high-temperature rapid heat treatment is conducted in a temperature range of about 900° C. to about 1100° C.
申请公布号 US6251718(B1) 申请公布日期 2001.06.26
申请号 US19980011891 申请日期 1998.02.23
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 AKAMATSU KAORI;ODANAKA SHINJI;UMIMOTO HIROYUKI
分类号 H01L21/265;H01L21/28;H01L21/324;H01L21/74;H01L21/8238;H01L29/10;(IPC1-7):H01L21/823 主分类号 H01L21/265
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