发明名称 ULTRASONIC TREATMENT APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC PART USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an ultrasonic treatment apparatus which efficiently carries out washing treatment and resist separation treatment by radiating ultrasonic waves evenly to the wide entire surface area using ultrasonic oscillators each of a smaller size than the ultrasonic wave radiation region with a prescribed width and to provide a manufacture method of electron parts using the treatment apparatus. SOLUTION: A plurality of ultrasonic oscillators 13... are so arranged that the projection figure 18 formed by projecting these ultrasonic oscillators 13... in a plane in the transportation direction A side and having the plane-like extent in the transportation direction A and the width direction B of a glass substrate 10 becomes one belt-like region having a width with the prescribed width value or wider.
申请公布号 JP2001170581(A) 申请公布日期 2001.06.26
申请号 JP19990359805 申请日期 1999.12.17
申请人 SHARP CORP;HONDA ELECTRONIC CO LTD 发明人 KOBAYASHI KAZUKI;ONO HITOSHI;TAGUSA YASUNOBU;HIKITA TOMOMI;MAITA YUICHI
分类号 B08B3/12;B06B1/06;B06B3/04;H01L21/027;H01L21/304;(IPC1-7):B08B3/12 主分类号 B08B3/12
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