| 摘要 |
An apparatus and method for cooling substrates is disclosed wherein the apparatus contains a cooling mechanism having a cooling plate, components for circulating a cooling fluid through the cooling plate, a positioning mechanism which positions the substrate relative to the cooling plate during operation of the apparatus and a housing for containing the cooling mechanism, the positioning components and the circulating components. The cooling plate has a non-planar top surface which provides an enlarged surface area used to cool the substrate. The cooling apparatus may be used in conjunction with a larger processing apparatus to fabricate an information storage disk.
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