| 摘要 |
The present invention provides a simple, reproducible electroless process for metalizing a non-hermetic optical fiber. The process of the present invention provides the optical fiber with a metalization layer suitable for solder bonding the optical fibers to other surfaces. The silica surface of the optical fiber is sensitized with a stannous fluoride solution, catalyzed with a catalyzing solution of stannous chloride and hydrochloric acid, and activated with an activator solution comprising palladium chloride. The sensitizing, catalyzing and activating steps are performed under ambient condition. Then nickel is plated on the silica surface through electroless plating and electrolytic plating. Finally, a gold layer is plated on the nickel layer. The process produces good adhesion properties and reliable optical fiber attachment for various applications.
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