发明名称 HEAT TREATMENT APPARATUS, COOLING APPARATUS AND COOLING METHOD
摘要 PURPOSE: A heat treatment apparatus, cooling method and apparatus are provided to shorten the recovery time. CONSTITUTION: A baking apparatus(34) comprises a temperature control unit(62), which controls a heater(61) in hot plate(60) with a PID, and a parameter- changing unit(63) controlled with the PID, which changes each control parameter for each different temperature. A cooling apparatus comprises a temperature control unit, which controls a peltier element in a cooling plate in the PID and a parameter-changing unit controlled with PID, which changes each control parameter based on the temperature of the cold plate detected by a temperature sensor.
申请公布号 KR20010051755(A) 申请公布日期 2001.06.25
申请号 KR20000068318 申请日期 2000.11.17
申请人 TOKYO ELECTRON LIMITED 发明人 HARADA KOJI;OKURA JUN
分类号 H01L21/02;G05B11/42;G05D23/19;H01L21/00;(IPC1-7):H01L21/02 主分类号 H01L21/02
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