| 摘要 |
PURPOSE: A heating treatment apparatus is provided to prevent the generation of an irregularity in the line widths of a pattern consisting of a coating film on a substrate. CONSTITUTION: A sensor part(64) for measuring the thickness of a resist film on the surface of a wafer(W) is movably provided in a post exposure baking device(44) and the measurement is measured during a heating treatment on the wafer(W). The set temperature of a heater(62) which is built in a heating plate(61) is adjusted from the correlation between the previously found step and the final line width of a pattern consisting of a coating film on the substrate after continuous treatments on the substrate so that the step is confined within the prescribed extent.
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