| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for polishing a semiconductor substrate wafer in which productivity is prevented from lowering by eliminating variation of polishing in the wafer plane. SOLUTION: A semiconductor substrate wafer 2 is supported on an wafer supporting table 3 while directing the plane to be polished upward and a polishing roller 1 is brought into pressure contact with the plane to be polished of the semiconductor substrate wafer 2 thus rolling the polishing roller 1. Lateral width of the polishing roller is set equal to one shot width of exposure and one shot of exposed region is polished at one time. The polishing apparatus may comprises means for measuring the region to be polished of the wafer being fed with slurry for each shot of photoengraving process through field observation, and means for setting the polishing conditions of the polishing roller based on the measurements. |
