| 摘要 |
PROBLEM TO BE SOLVED: To provide a switching device which can be surface-mounted on a printed wiring board. SOLUTION: Electrode lead-out terminals 16 and 17 each keep one end joined to each of electrode pads 14 and 15 formed on the surface of a switching semiconductor chip 11, and the other end formed into a prescribed shape and led out, by which the switching semiconductor chip 11 can be surface-mounted on a printed wiring board. |
