摘要 |
PROBLEM TO BE SOLVED: To confirm the relative positional relation of a semiconductor chip with a collet from the outside in a state that the collet is covered with a semiconductor chip. SOLUTION: This semiconductor suction collet is provided with a tapered part constituted of plural tapered faces forming a suction space for sucking a semiconductor chip from an opening, an air passage for depressurizing the suction space, and a notched windows formed at the corner of the suction space of the notches of the two adjacent taper faces through which the upper and both side faces of the upper corner of the semiconductor chip corner are exposed.
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