发明名称 SEMICONDUCTOR SUCTION COLLET AND DIE BOND DEVICE
摘要 PROBLEM TO BE SOLVED: To confirm the relative positional relation of a semiconductor chip with a collet from the outside in a state that the collet is covered with a semiconductor chip. SOLUTION: This semiconductor suction collet is provided with a tapered part constituted of plural tapered faces forming a suction space for sucking a semiconductor chip from an opening, an air passage for depressurizing the suction space, and a notched windows formed at the corner of the suction space of the notches of the two adjacent taper faces through which the upper and both side faces of the upper corner of the semiconductor chip corner are exposed.
申请公布号 JP2001168114(A) 申请公布日期 2001.06.22
申请号 JP19990347447 申请日期 1999.12.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIYAKE HIROYUKI
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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