| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for printed circuit boards for forming fine wiring and via by solving the conventional problems and miniaturizing a semiconductor package which is fitted to the inside of electronic equipment and a lamination plate for mounting it, reducing its weight, and improving its performance and functions. SOLUTION: This laminate for printed circuit boards is provided with a multilayer structure that is composed of a separation layer for isolating and insulating a printed circuit formed on the laminate and a support layer for supporting the laminate, the isolation layer is made of short fiber paper of heat-resistance organic macromolecular polymer, and at least one layer of the support layers is made of woven cloth and is arranged at the inner-layer part of the laminate. |
