| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thin interconnection structure. SOLUTION: The thin interconnection structure comprises an electronic circuit module having a plurality of mounting regions and a plurality of electric contact regions determined by the mounting face. The plurality of mounting regions are parallel with the mounting face and spaced apart for a first distance from a mounting/interconnection face spaced apart therefrom. The plurality of electric contact regions are spaced apart for a second distance, shorter than the first distance, from the mounting/interconnection face. A large solder ball is used between the mounting region and the mounting/interconnection face to form solder mounting and thereby a small solder member is used for electrical interconnection.</p> |
